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IC processing, covering topics including:
· CMOS wafer post-processing – can we fabricate new components on top of a microchip? See our position paper on this subject.
· Novel devices – can we incorporate light emitting diodes, high-quality passives, gas sensors etc. into a CMOS process?
· Nanotechnology, such as novel thin films, nanocrystal memories, ultrathin silicon, and silicon nanowires
Device characterization and reliability:
· Novel characterization methods to measure the capacitance-voltage relation
· Improving characterization methods to measure contact resistances
· Reliability of MOS devices, interconnect, and novel devices
Device physics and modeling, covering topics including:
· Ultra-thin silicon – can we understand and model silicon, when it is hardly three-dimensional anymore?
· How is a bulk-acoustic-wave resonator modeled?
· How are silicon LED’s modeled?
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